By Prof. Yangdong Deng, Prof. Wojciech P. Maly (auth.)
"3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the idea that and value of third-dimensional (3-D) VLSI. The authors have constructed a brand new 3-D IC integration paradigm, so-called 2.5-D integration, to handle many difficulties which are tough to solve utilizing conventional non-monolithic integration schemes. The ebook additionally introduces significant 3-D VLSI layout concerns that must be solved via IC designers and digital layout Automation (EDA) builders. by way of treating 3-D integration in an built-in framework, the publication presents vital insights for semiconductor strategy engineers, IC designers, and people operating in EDA R&D.
Dr. Yangdong Deng is an affiliate professor on the Institute of Microelectronics, Tsinghua college, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor on the division of electric and machine Engineering, Carnegie Mellon collage, USA.
Read Online or Download 3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme PDF
Best nonfiction_7 books
This booklet, which derives from an initiative of the schooling Committee of The overseas Society of Arthroscopy, Knee surgical procedure and Orthopaedic activities drugs (ISAKOS), addresses all elements of elbow arthroscopy. Anatomy is punctiliously brought, referencing secure portals and describing concepts to lessen probability of issues.
The appliance of a “committee of specialists” or ensemble studying to man made neural networks that observe unsupervised studying thoughts is generally thought of to reinforce the effectiveness of such networks drastically. This booklet examines the opportunity of the ensemble meta-algorithm by way of describing and trying out a strategy in line with the mix of ensembles and statistical PCA that's in a position to ascertain the presence of outliers in high-dimensional information units and to reduce outlier results within the outcome.
Asymptotic equipment are of significant value for useful purposes, specially in facing boundary price difficulties for small stochastic perturbations. This publication offers with nonlinear dynamical platforms perturbed through noise. It addresses difficulties the place noise results in qualitative alterations, get away from the charm area, or extinction in inhabitants dynamics.
- Topological Modeling for Visualization
- Spin-one color superconductivity in cold and dense quark matter
- Cooperative Control: A Post-Workshop Volume 2003 Block Island Workshop on Cooperative Control
- Second Bull Run staff ride : briefing book
Extra resources for 3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme
Int’l Electronic Device Meeting, 2000, pp. 165 168.  M. Koyanagi, H. Kurino, Kang Wook Lee, K. Sakuma, N. Miyakawa, H. Itani. Future system-on-silicon LSI chips. IEEE Micro, Vol. 18, July-Aug. 1998, pp. 17 22. 18 1 Introduction  S. Strickland, E. Ergin, D. R. Kaeli, P. Zavracky. VLSI design in the 3rd dimension. Integration: the VLSI Journal, Vol. 25/1, Sep. 1998, pp. 1 16.  S. M. Alam, D. E. Troxel, C. V. Thompson. A comprehensive layout methodology and layout-specific circuit analyses for three-dimensional integrated circuits.
5-Dimensional Integration Scheme improving deep-submicrometer interconnect performance and systems-on-chip integration. Proceedings of the IEEE, Vol. 89, 2001, pp. 602 633.  V. Subramanian, M. Toita, N. R. Ibrahim, S. J. Souri, K. C. Saraswat. Low-leakage Germanium-seeded laterally-crystallized single-grain 100 nm TFTs for vertical integration applications. , Vol. 20, Jul. 1999, pp. 341 343.  G. W. Neudeck, S. Pae, J. P. Denton, T. Su. Multiple layers of silicon-on-insulator for nanostructure devices.
Strickland, E. Ergin, D. R. Kaeli, P. Zavracky. VLSI design in the 3rd dimension. Integration: the VLSI Journal, Vol. 25(1), Sep. 1998, pp. 1 16.  S. M. Alam, D. E. Troxel, C. V. Thompson. A comprehensive layout methodology and layout-specific circuit analyses for three-dimensional integrated circuits. In: Proc. Int’l Sym’m on Quality Electronic Design, 2002, pp. 246 251.  J. -Q Lu, et al.. A wafer-scale 3-D IC technology platform using dielectric bonding glues and copper damascene patterned inter-wafer interconnects.